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The 8329TCS Slow Cure Thermal Conductive Adhesive is an electronically insulating epoxy that combines long working time and high conductivity with ease of use. Mixed adhesive essentially behaves like a 1-part adhesive for the duration of a work shift. Doesn’t require temperatures as high as 130 and 170°C, and it will cure at a more moderate 80°C in less than 1 hour. Bonds very well to most substrates used in electronic assemblies; and resists thermal and mechanical shocks.