- Alloy: Sn96.5/Ag3.0/Cu0.5
- Flux Type: Synthetic No-Clean
- Flux Classification: REL0
- Metal Content: 87% metal by weight.
- Particle Size: T4 (20-38 microns)
- Melting Point: 217-220C (423-428F)
- Size: 60g Two Part Mix
Before Mixed: Refrigerated >24 months, unrefrigerated >24 months
After Mixed: Refrigerated >6 months, unrefrigerated >2 months
>8 hours @ 20-50% RH 22-28C (72-82F)
>4 hours @ 50-70% RH 22-28C (72-82F)
Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA).
Storage and Handling
Before Mixed: Store refrigerated or at room temperature 3-25C (37-77F). Do not freeze.
After Mixed: Refrigerate at 3-8C (37-46F). Do not freeze. Allow 4 hours for solder paste to reach an operating temperature of 20-25C (68-77F) before use.
Once mixed, the solder paste can be dispensed by cutting a small corner off the bag. It can be resealed with a piece of tape, or it can be stored by dispensing the entire bag into the provided empty jar.
|MCM Part #:||21-20650|
|Chip Quik Part #:||SMD291SNL60T4|
|Package Specifications & Dimensions|
Need to Return?
|Extra Shipping Charge:||No|