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Kester 186 rosin flux has been developed for use in critical applications where difficult assemblies are to be soldered, but process requirements stipulate use of Type RMA flux.
This flux possess high thermal stability for soldering multi-layer assemblies which require a high preheat temperature. Exposure to high preheat temperatures does not degrade solubility of the residue in normal cleaning solvents. There is no surface insulation resistance degradation caused by the flux residue.