Silicone Free Heat Sink Compound
By Techspray (1978-DP)
MCM Part #20-2145
Silicone free compound is applied under power transistors and other heat generating devices to assist in transferring heat to metal chassis for dissipation. Product will not harden, dry out, melt, or contaminate wave solder baths. Exceptionally low bleed and evaporation characteristics allow use with both metal and plastic cap transistors. Designed to eliminate silicone migration. Temperature range from -40°C~200°C. Can be removed with the use of Tech Spray Envi-Ro-Tech 1675 (#20-2220). 4 oz. squeeze tube. Mfr. #1978-DP.